S2C adds 9 New Prototype Ready™ Accessories to its Rapid SoC Prototyping Environment
Sep 13, 2011

S2C adds 9 New Prototype Ready™ Accessories to its Rapid SoC Prototyping Environment

Prototype Ready Accessories Shorten the Prototype Development Time

San Jose, CA – September 12, 2011 – S2C announced that it has added 9 new Prototype Ready accessories to its broad portfolio of Prototype Ready: accessories, reference designs and IP. These Prototype Ready pre-engineered solutions accelerate the prototype development time by giving the designer a broad array of choices on how to implement the prototype and how to interface the prototype to the actual operating environment.

Mon-Ren Chene, Chairman and CTO of S2C said: “our focus is on giving our customer the building blocks to rapidly create SoC prototypes. We pride ourselves in working closely with our customers and in adding products to our portfolio to meet our customer’s special requirements.  Many of these new Prototype Ready accessories were developed to meet specific customer needs."

The 9 new accessories fall in 3 different categories.

1. General Peripheral Modules

D-Max Interface Module - convenient debugging using external Tektronix Logic Analyzer to monitor I/O signals on TAI LM. It has 8 switches, 8 LED, 3 push buttons and many jumper pins.

2 Channel PCIe x8 Gen2 Root Complex Module - equipped with an Altera Stratix-4 180GX FPGA device and has 2 PCIe Gen2 8-lane Root Port Slot (16 SerDes), one  SATA2.0 interface and one Gigabit transceivers through SMA connectors.  The module also has 4 TAI Logic Module IO connectors supplying up to 480 general purpose I/O that can be served as an extension for S2C TAI Logic Module users thorough stacking or cabling.

2. General Expansion Modules

TAI LM Interconnection Module Type A - connects 2 horizontally aligned TAI LM connectors

TAI LM Interconnection Module Type B - connects 2 vertically aligned TAI LM connectors and provides 2 clocks input through OSC sockets and 1 push-button reset.

Alternative Quad V6 Conversion Package - converts 2 S2C Dual Virtex-6 TAI Logic Module to a 4 FPGA SoC/ASIC Prototyping platform. The package includes 6 TAI LM Interconnection Modules (4 P-IMA and 2 P-IMB) and an Acrylic Mother Board to fix the position of 2 TAI LM and daughter boards for a physically robust system.

Connector Spacer Module - adds height between a TAI LM I/O Terminal Connector and a TAI Logic Module I/O Socket connector.

Virtex-6 I/O Level Shifting Module - allows Virtex-6 TAI LM 2.5V I/O to connect to 3.3V devices.

3. Memory Modules

2 Channel 128 MB NOR Flash Memory Module - provides 2 channels of 128M bytes of external NOR flash Memory for TAI Logic Module and is configured as 2 channels of 64M x 16 bits.

4. Multimedia Modules

VGA Interface Module - Provides one DB25 VGA interface which supports up to 1600x1200 resolution @100MHz.

Availability

All of these new Prototype Ready accessories are available today.



Request for Quote

What type of chip are you designing?
What is the capacity of the ASIC gate included in the design?
5 million-20 million
20 million-50 million
50 million-100 million
100 million-1 billion
More than 1 billion
Which FPGA do you prefer to use?
Xilinx VU440
Xilinx KU115
Xilinx VU19P
Xilinx VU13P
Xilinx VU9P
Intel S10-10M
Intel S10-2800
Not sure, need professional advice
What kind of FPGA configuration do you need?
Single FPGA
Dual FPGA
Four FPGAs
Eight FPGAs
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What kind of peripheral interface do you need?
How many prototype verification platforms do you need?
Do you need the following tools?
Segmentation tool
Multiple FPGA debugging tools
Co-modeling tool (allows large amounts of data to interact between FPGA and PC host)
When do you need to use our products?
0-6 months
6-12 months
More than 12 months
Not sure
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